DB1 Silver, Ultra-Compact Fanless ITX ChassisDiscontinued
DB1 Black, Ultra-Compact Fanless ITX ChassisDiscontinued
|More variations available|
Streacom DB1 Ultra-Compact Fanless ITX Chassis
The DB1 is an ultra-compact fanless ITX case, designed to be paired with the new generation of APU/IGPUs, that is both competitively priced and built without any sacrifice on design or quality.
- Incredibly small fanless ITX chassis
- Accommodates CPUs up to 45W TDP
- Beautiful sandblasted finish
- Horizontal or vertical orientation
The high-end CPU and GPU performance arms race has been pushing power and TDP limits higher but fortunately, progress is also being made for more power-efficient CPUs with much lower TDPs that still offer competitive performance thanks to improvements in their integrated graphics.
Whilst there is no shortage of fanless cases on the market that can cool these lower TDP CPUs, they have been geared towards industrial applications, tend to be expensive, and offer very little in the way of design.
The DB1 is here to change that with a case that delivers all the benefits of fanless/silent computing, but in an ultra-compact form factor that once again breaks the mould of typical fanless cases.
With a total volume less than 5l, the DB1 is Streacom’s most compact fanless case but can still comfortably handle 45W of cooling, which is ideal for power-efficient systems based on the new generation of APU/IGPUs that deliver excellent performance/watt.
The DB1 is constructed from 4mm thick aluminium panels, a 21mm thick extruded heat sink, solid aluminium pillars and is made using CNC milling and finished with sandblasted/anodised surface treatment, but despite using these premium materials, processing and finishing, is extremely competitively priced.
The beauty of the DB1 (apart from its appearance) is the simplicity of its design that used 4 solid aluminium pillars to connect the heat sink and side panel that in turn secure the front, rear, upper and lower panels in place. This approach greatly reduces complexity, combines functionality (as the pillars also serve as the feet), and mean that the entire case can be fully disassembled with just 8 screws.
This design also allows for great flexibility in orientation and placement of the case, every panel can be rotated to allow for left or right positioning and inverted orientations. The modularity also means that requirements for customisation are lower, making this an excellent platform for system integrators.
The Case is the Cooler
Just like other Streacom chassis, the cooling is done by the case itself and the DB1 continues that trend. Using the same copper CPU shim, adjustable CPU mount and heat sink mount found in the DB4, heat is transferred from the CPU to the heat sink (side panel) using 6mm copper heat pipes and dissipated into the environment along its surface and fins which are optimised for natural convection.
With the combination of the universal CPU mount and fully position adjustable heat sink mount, there are virtually no motherboard compatibility issues as the socket location is not a limiting factor and conflicts with board components are minimised. The stock CPU mount is compatible with all current desktop sockets and there is also an optional compact CPU mount to expand that compatibility to less common sockets such as FCBGA 1667 or even more specialist soldered CPUs.
Power and Size Optimised
It’s hard to appreciate just how small and tightly packed some compact ITX cases are. For some context, the DB1 is not much larger than the ITX motherboard it holds, and this ultra small form factor is only made possible by the use of a NanoPSU that plugs directly into the motherboard.
Apart from reducing the space required, use of the NanoPSU has two other advantages. Firstly, it reduces the amount of heat being dumped inside the case as the AC to DC conversion is happening in the external AC adapter, and secondly, it is fanless, there is no need to expand on how important that is for a fanless system.
With the target TDP, power draw and price point that the DB1 was designed for, it was important to have a suitable matching power solution, so Streacom recently release a new NanoPSU that can match these criteria. The Nano90 is Streacom’s most compact and affordable NanoPSU yet, delivering 90W of power with zero noise.
Modularity and versatility are principles Streacom always try to incorporate into their designs, so with the DB1 all the panels are interchangeable the added option to rotate the internals by 90 degrees, allowing any variation of heat sink and front panel position/orientation.
The DB1 was of course designed to work primarily in the vertical orientation as that occupies the least amount of desk space and also gives the best cooling performance as convection is optimised. It can however also be used in the horizontal orientation with the ability to position the front I/O at either side of the case.
The front I/O is also modular and uses the same module as the DA2, meaning the supplied Type-A USB port can be replaced with a Type-C USB port or any yet-to-be-released standard.
This modularity and cross-platform approach is part of Streacom’s wider commitment to product continuity and ensuring the case you buy today does not become obsolete when new hardware is released. The optional Type-C module is currently yet to be released.
|Case Form Factor||Mini-ITX||Mini-ITX|
|CPU TDP Cooling||45W||45W|
|Drive Support||1x 2.5”||1x 2.5”|
|PSU Support||NanoPSU only, not supplied||NanoPSU only, not supplied|
|Front Port||USB Type-A 3.0 (Replaceable) *||USB Type-A 3.0 (Replaceable) *|
|External Dimensions||222 x 222 x 101mm, 4.98ℓ||222 x 222 x 101mm, 4.98ℓ|
|Primary Material||Aluminium 6063||Aluminium 6063|
|Warranty||24 months||24 months|
- *Type-C USB module is currently unavailable
|Case Form Factor||Mini-ITX|
|CPU TDP Cooling||45W|
|Drive Support||1x 2.5”|
|PSU Support||NanoPSU only, not supplied|
|Front Port||USB Type-A 3.0 (Replaceable) *|
|External Dimensions||222 x 222 x 101mm, 4.98ℓ|
|Primary Material||Aluminium 6063|
- *Type-C USB module is currently unavailable
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